Thomas the Tank Engine Posted November 26, 2015 Share Posted November 26, 2015 This may look like a regular RAM chip, but oh my it packs a punch. This is the latest chunk of RAM to roll off Samsung’s production line—and it squeezes a giddying 128GB into its svelte little frame. The chip, designed for big enterprise servers, uses Samsung’s “through silicon via” manufacturing technique. That allows the company to connect RAM chips vertically using electrodes passing through holes rather than more conventional wiring you find in other RAM. In turn, that allows it to build up memory into larger 3D stacks, to squeeze more into the same footprint. Read the rest: http://gizmodo.com/this-is-samsungs-crazy-new-128gb-ddr4-ram-chip-1744776220 xrobwx71 1 Share Link to comment Share on other sites More sharing options...
spaceelf Posted November 27, 2015 Share Posted November 27, 2015 Seems like normal systems should be moving to SO-DIMMs if they can pack that much into one larger chip. Link to comment Share on other sites More sharing options...
Recommended Posts