AMD Drives Integrated Peltier Cooling into Chips

Advanced Micro Devices, one of the world's leading makers of central processing units, has patented a technology that would allow the chipmaker to use so-called Peltier cooler with its future microprocessors for better heat dissipation and more efficient cooling of future chips. Still, the fact of the patent does not mean that the tech will find itself in commercial products.

"Various embodiments of a semiconductor-on-insulator substrate incorporating a Peltier effect heat transfer device and methods of fabricating the same are provided. In one aspect, a circuit device is provided that includes an insulating substrate, a semiconductor structure positioned on the insulating substrate and a Peltier effect heat transfer device coupled to the insulating substrate to transfer heat between the semiconductor structure and the insulating substrate," says an abstract description of US patent number 6,800,933 submitted by AMD.

News source: X-bit labs

Previous Story
Yahoo Purchases E-Mail Search Company
Next Story
Windows v Linux security: the real facts