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Thanks Dazog from our BPN Forum

This is the latest known release of VIA system drivers also known as 4-in-1 package. This release features a new installer.

This is an official release including:

• New security catalog files
• VIA AGP driver 4.20
• VIA Inf driver 1.60a
• WHQL Certificate

News source: Warp2Search
Download: VIA 4-in-1 v4.40A

Standard chip production involves printing a tiny intricate pattern of transistors and wiring on to a silicon wafer.

The circuitry is then etched into the silicon and the printed image removed.

Because the individual features of the chip are so tiny, as narrow as 130 nanometres (millionths of a millimetre) in current chips, the printing machine can cost well over £10m.

An entire chip factory can cost in the order of a billion pounds.

The etching and image removal stages of the manufacturing process involve use of substantial amounts of chemicals which can place a load on the environment.

Professor Chou's process, described in the scientific journal Nature, involves a simple mechanical printing of the features of the chip.

A quartz die is pressed against the silicon, which is melted briefly by a laser.

Professor Chou says his invention can produce chip features 10 times narrower than current techniques.

If he manages to put his invention into practice, it will enable chip builders to pack 100 times as many components into the same area of silicon.

The more densely packed the components on a chip, the faster the chip can run, because the signals passing through its circuitry arrive more quickly.

Professor Chou's process has the potential to be cleaner, too.

"In our process there is no waste. It's a purely physical process with no chemicals," he said.