Network computer maker Sun Microsystems Inc. researchers will report on Tuesday that they have devised a way to dramatically increase the speed at which semiconductors can talk to each other.
By placing the chips edge to edge, directly touching, so data can flow freely, Sun has taken out the need for the tiny wires, pads and solder points that now connect chips on printed circuit boards that help make up computer systems, Sun said. The breakthrough could mean sending data among chips up to 100 times faster than current top transmission rates on traditional semiconductor-chip interconnects, Sun said. It would also solve one of the oldest challenges in the chip industry: the bottlenecks that crop up when chips -- which are getting ever faster -- are connected to one another. "It's faster, cheaper, and uses less power," said John Gustafson, principal investigator for Sun's high productivity computing systems.
Hit hard by downturn
Sun already holds seven patents on the new design and will seek to capitalize on them commercially, a Sun spokesman said. The New York Times on Monday first reported on the apparent breakthrough. Even though Sun has been harder hit than rivals International Business Machines Corp., Dell Inc. and Hewlett-Packard Co. in the technology downturn, it continues to invest aggressively in research and development.
News source: CNN
By placing the chips edge to edge, directly touching, so data can flow freely, Sun has taken out the need for the tiny wires, pads and solder points that now connect chips on printed circuit boards that help make up computer systems, Sun said. The breakthrough could mean sending data among chips up to 100 times faster than current top transmission rates on traditional semiconductor-chip interconnects, Sun said. It would also solve one of the oldest challenges in the chip industry: the bottlenecks that crop up when chips -- which are getting ever faster -- are connected to one another. "It's faster, cheaper, and uses less power," said John Gustafson, principal investigator for Sun's high productivity computing systems.
Hit hard by downturn
Sun already holds seven patents on the new design and will seek to capitalize on them commercially, a Sun spokesman said. The New York Times on Monday first reported on the apparent breakthrough. Even though Sun has been harder hit than rivals International Business Machines Corp., Dell Inc. and Hewlett-Packard Co. in the technology downturn, it continues to invest aggressively in research and development.
BizTalk Accelerator for Financial Services 1.0 SR1 MessagePack 2003 has implemented the final 2003 SWIFT Standards Release Guide (SRG) and Message Format Validation Rules (MFVR). Legacy messages that have been removed from SRG 2003 by SWIFT but are still supported in this MessagePack will conform to the most recent SRG in which they were still included (prior to SRG 2003).
BizTalk Accelerator for Financial Services 1.0 SR1 MessagePack 2003 is a patch to BizTalk Accelerator for Financial Services 1.0 SR1 and is not a standalone product. Therefore, once installed, product support for the MessagePack 2003 will be covered by existing BizTalk Accelerator for Financial Services 1.0 SR1 support agreement(s).

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