A REPORT IN Taiwanese magazine Digitimes said Intel has finished the spec for its future 802.11b modules and released it to manufacturing by D-Link and GemTek.
Last time we talked to Intel about 802.11g Centrino wireless kits, it seemed confident it could release them before the end of the year.
But Digitimes says it will produce volume shipments in the first quarter of next year. That is also the time when Intel is slated to introduce its future "Dothan" version of the Pentium M, which is produced on a 90 nanometer process and has 2MB of cache on the die. Last month, Intel said it would start producing 802.11a as well as 802.11b modules for notebooks using the triple Centrino bundle.
News source: The Inq
Last time we talked to Intel about 802.11g Centrino wireless kits, it seemed confident it could release them before the end of the year.
But Digitimes says it will produce volume shipments in the first quarter of next year. That is also the time when Intel is slated to introduce its future "Dothan" version of the Pentium M, which is produced on a 90 nanometer process and has 2MB of cache on the die. Last month, Intel said it would start producing 802.11a as well as 802.11b modules for notebooks using the triple Centrino bundle.
News source: The Inq
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