At the AMD Taiwan Embedded Forum this week, AMD added new processors and a new chipset to its embedded roadmap. New CPUs include the high performance AMD Turion 64 X2 Dual-Core processors TL-56 and TL-62 and an energy-efficient AMD Sempron 3700+. Also available now is an updated version of the Mobile AMD Sempron processor 2100+, which achieves up to a 15% reduction in thermal design power. All of these new products feature a consistent Socket S1, allowing for quicker development and delivery times through socket consistency and platform longevity. The latest AMD M690E chipset provides additional display design flexibility for embedded graphics and enables seamless playback of high definition video content for embedded applications.
As well, AMD is offering a COM Express form factor reference design kit which enables OEMs to quickly design embedded systems that deliver high quality graphics, high performance, and high I/O throughput.
“Our expanded embedded roadmap was born out of customer demand. The embedded market wanted to take full advantage of the unique AMD Direct Connect Architecture, and we are consistently providing additional options for these customers, often with specific requested features above those offered in our mainstream product lines. As functionality in embedded systems continues to grow, both in commercial and consumer products, AMD provides leading-edge technology at the right time for the market,” said Buddy Broeker, director, Embedded Computing Solutions Division at AMD.
Link: AMD Embedded
Commenting has either been disabled on this article or you are not logged in. Click here to login or register, its free!
Note: Anonymous commenting is disabled in order to keep the quality of responses to a high standard.