OCZ Technology has announced its newest memory design, codenamed Flexpipe, as being available on high-end OCZ XTC as early as February 2007. The design constitues a heatpipe that transfers heat from the module to another heatsink a centimeter above the memory bank. The memory bank is air-cooled; air can pass freely under and over the heatsink bank - making it easier to cool multiple modules. The company announced that pre-production trials have finished and January 2007 will be used for test trials. OCZ Technology Vice President of Marketing and Communications, Alex Mei, claimed that the Flexpipe design will be priced more aggressively than the watercooled or aircooled OCZ FlexXLC modules.