VOIP to Make Mainstream Move at CES

Devices necessary for making VOIP (voice over IP) work in new ways will make their debut at the International Consumer Electronics Show in Las Vegas this week. These products include a chip-level solution that will soon find its way into end-user products, as well as a new technology line and some end-user products that are ready to ship.

One anticipated technology is support for wireless VOIP. DSP Group Inc., based in Santa Clara, Calif., will announce what it calls its Cordless IP chip. The chip combines traditional telephony and digital cordless technology in a single package. According to the company, the new chip is designed to support multihandset, VOIP multiline phones. The product's primary market is residential. A company spokesman said the new chip would work with 2.4 GHz and 5.8 GHz handsets using today's cordless technology, and with the new 1.9 GHz standard

View: The full story

News source: eWeek

Previous Story
Intel 'Smithfield' chipsets said to support SATA 2
Next Story
Intel Preps Onslaught with New Pentium 4 Processors 600