New reports details Xiaomi Mi 9 specifications, including Snapdragon 8150 SoC

Xiaomi's Mi line of smartphones has always been some of the most feature-packed and competitively priced hardware you can buy. Its Mi 8 was met with rave reviews, and as the company sets its sights on the phone's successor next year, we're now getting a few tidbits about the device's internals.

The report from Gizchina, which cites supply chain sources, indicates that the phone will be released sometime in the first half of 2019. This would align well with Xiaomi's history, as the Mi 8 was released in June of this year. Alongside an expected ETA, the report also gives some insights into the specs of the upcoming phone.

The Mi 9 will reportedly sport a triple-camera setup - a first for any Xiaomi device - with the main camera being a 48MP Sony sensor, the IMX586. It will also include 6/8GB of RAM. Xiaomi will likely also follow industry-wide trends and retain the in-display fingerprint sensor from the Mi 8 Pro and wireless charging for the phone.

More interestingly, the report suggests the Mi 9 may be the first phone to be released with a Snapdragon 8150 inside, the company's next flagship mobile processor. The 8150 is a rebranding of the Snapdragon 855, and is expected to be Qualcomm's first 7nm processor, bringing the company up to speed with respect to its competitors in Apple and Huawei.

However, this part of the report may be a little dubious, as it's normally Samsung's S series phones, often announced at the start of the year, that lay claim to being the first phones with the latest and greatest from Qualcomm. With the Mi 9 not being released until May/June, at best, it's unlikely that it will be the first phone with the Snapdragon 8150, though it will undoubtedly have the chipset inside.

Source: Gizchina

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