Neowin News Feed for: Hbm

Samsung begins shipment of HBM4E samples to "major global customers"

David Uzondu — Fri, 29 May 2026 05:10:01 +0000

Just months after shipping HBM4, Samsung has announced that it has begun shipping HBM4E to partners to support "increasingly demanding next-generation AI workloads." Read more...

Samsung reportedly postpones production for latest 10nm DRAM for indefinite period

Sanket Mungase — Wed, 22 Apr 2026 10:02:01 +0000

The production for 10nm DRAM called "D1d" has reportedly been paused by Samsung for an indefinite period due to low profitability and low demand from customers. Read more...

Samsung just raised prices on many Galaxy phones and tablets, here's the full list

Karthik Mudaliar — Tue, 14 Apr 2026 18:24:01 +0000

Samsung has raised prices on months-old devices across its U.S. stores, hitting phones, foldables, and nearly every tablet it sells. Some jumped over $200 with zero warning. Read more...

Raspberry Pi announces surprising price hikes up to $10 on select Compute Modules and Pi 500

Paul Hill — Wed, 01 Oct 2025 13:08:01 +0000

Raspberry Pi is adjusting prices on high-density products (4GB/8GB) due to a 120% jump in LPDDR memory costs, a side effect of the AI boom. Read more...

Nvidia prepping special RTX PRO 6000 GPU for China to meet US export controls

Paul Hill — Wed, 28 May 2025 11:20:01 +0000

Nvidia is preparing a special edition of the RTX PRO 6000 GPU for the Chinese market. It will use different memory to meet US export controls. Read more...

Samsung GDDR6W takes GDDR6 graphics memory to HBM2E levels

Sayan Sen — Tue, 29 Nov 2022 11:36:01 +0000

Samsung has announced its next evolution of GDDR memory in the form of the new GDDR6W technology. The new tech promises close to HBM levels of performance while smaller than traditional GDDR6. Read more...

Intel Max series is the first CPU with HBM, promises 68% less power use than AMD

Fiza Ali — Wed, 09 Nov 2022 16:18:01 +0000

Intel has unveiled the Intel Max Series product family for high-performance computing (HPC) and artificial intelligence ahead of Supercomputing '22 (SC22) in Dallas happening between November 14-17. Read more...

Samsung's H-Cube solution to allow efficient integration of 6 HBMs, and lower cost benefit

Fiza Ali — Thu, 11 Nov 2021 13:08:01 +0000

Samsung Electro-Mechanics (SEMCO) and Amkor Technology have partnered to develop a 2.5D Integration 'H-Cube' solution specialized for semiconductors for HPC, AI, data center, and network products. Read more...

Next-gen HBM3 details inadvertently leaked by SK hynix

Sayan Sen — Thu, 10 Jun 2021 05:24:01 +0000

SK hynix recently updated its website and it appears to have inadvertently leaked some of the details of next-gen 3D stacked HBM3. The new memory will be close to 50% faster than the current HBM2E. Read more...

Samsung's new HBM-PIM claims to be twice as fast while drawing over 70% less power

Sayan Sen — Wed, 17 Feb 2021 10:36:01 +0000

Samsung has introduced its latest processing-in-memory architecture or PIM. According to the firm, this new innovation is able to double the output while also significantly reducing the power draw. Read more...