MediaTek and NVIDIA have partnered up to develop new systems-on-chips for vehicles that will deliver AI and other infotainment features for all types of cars from entry-level to luxury.
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Apple is readying to announce new iMacs later this year, according to recent report. The new devices will reportedly be powered by the new M3 chip, which will offer improved performance.
Apple has announced the latest chips in its line of in house developed SoCs (system-on-a-chip), the M2 Pro and M2 Max, which increase CPU and GPU performance and support up to 96GB of unified memory.
The AMD Mendocino APU is built on the 6nm node and packs ZEN 2 CPU cores, and RDNA 2 GPUs, with support for LPDDR5 RAM. The chipset would offer better computing and graphics for budget laptops.
Apple has introduced a new class of desktop PC: Mac Studio. The new device, resembling a Mac Mini will pack the new M1 Ultra SoC, which comprises two M1 Max chipsets clubbed together.
After eight long years and successfully developing the Apple M1 System on a Chip, Jeff Wilcox is heading back to Intel, where he will design next-gen SoC, which would be based on the x86 architecture.
Google has shown off the Pixel 6 and Pixel 6 Pro early this year addressing the camera bar and the new Tensor SoC. With Tensor, Google hopes to get more out of AI and ML and make Android faster.
Samsung has unveiled chipsets for its 5G solutions at its virtual event. These chipsets will provide power efficiency, enhanced performance, and compact size in next-generation 5G RAN solutions.
MediaTek has announced a new chipset for high-end smartphones, the Dimensity 900, based on a 6nm process. It includes premium features like LPDDR5 and UFS 3.1 support, 5G, and more.
Samsung and Marvell have announced a new system-on-a-chip design for massive MIMO and advanced radios. It will become available to Tier One operators in the second quarter of the year.
MediaTek has introduced a couple of new high-end chipsets, the Dimensity 1200 and 1100. The former is the most high-end of the two, with a flagship 3GHz core and support for 200MP cameras.
Samsung today teased the launch date for its next-generation flagship SoC called the Exynos 2100. The South Korean tech giant has confirmed that it will announce the chipset on January 12.
Google and Qualcomm have worked to bring changes to Project Treble that reduces the effort required to support Android versions on new SoC, making up to four OS updates easier for OEMs.
Samsung has posted a trailer on YouTube termed "Thank you" and hints at something "small" planned for its fans on December 15. The firm's Exynos account on Twitter also posted the video.
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Tested on temperatures as low as 4K, Intel's new 22nm Horse Ridge II SoC not only allows the manipulation of qubit states but also the control of gate potentials to entangle qubits.
Samsung has formally announced the Exynos 1080 chipset, its next flagship mobile processor. It will use a 5nm process, and it promises great battery life. It will debut on a Vivo phone in early 2021.
Nokia is working with Tampere University to create a Center of Excellence. Nokia will improve the development of its ReefShark chipset and Tampere University will benefit from Nokia's expertise.
Horse Ridge, developed using Intel's 22nm FinFET technology, is a cryogenic, highly-integrated, mixed-signal SoC that will facilitate more efficient control of multiple qubits in a quantum computer.
While a fully integrated mobile platform with 5G connectivity from Qualcomm isn't expected until next year, it appears that benchmark results for the fabled Snapdragon 865 have been spotted online.
Just hours ahead of its Galaxy Unpacked event and the expected announcement of the Galaxy Note10, Samsung has unveiled its flagship Exynos 9825 SoC that shares quite a bit with its predecessor.
The latest smartphone SoC from Huawei, the Kirin 980, was revealed by the company at the end of August, and the company is now claiming its chip will be better than Apple's A12 Bionic.
Qualcomm has announced a new Snapdragon processor, meant to power the next generation of mid-range devices. The Snapdragon 670 offers up many features and improvements over its predecessor.
MediaTek announced its newest premium chipset today, the Helio P60. Built on a 12nm FinFET process, it includes an AI Processing Unit, or APU. It's a 70% improvement in CPU and GPU performance.
The Qualcomm Snapdragon 670 will be an octa-core chip in two+six configuration, with a 600 series GPU, according to a report. More details about the SoC may be announced at MWC in February.
Hardware and software makers continue to deal with the potential problems caused by processor vulnerabilities Meltdown and Spectre. Nvidia is the latest to do so, with updates for its SoCs and GPUs.
If you wanted to know when the next Samsung Galaxy, LG V-series, or any other device packing a Snapdragon 845 in 2018 will be announced, a new list could indicate when each will become official.
A new report indicates that Google has poached a significant amount of talent from Apple, which now includes veteran John Bruno, in a bid to bolster its capabilities in designing custom processors.
Samsung has announced that it has started the manufacturing its new second-generation 10nm processor. The SoC should appear in devices in early 2018, with wider availability later in 2018.
At IFA Berlin, Huawei finally announced its latest SoC, the Kirin 970. The firm touted the chip as its first "mobile AI computing platform" featuring a dedicated Neural Processing Unit.
Ever wonder why Samsung's chips are only found in Samsung devices? According to the South Korean government, it's because Qualcomm has been pressuring Samsung and barring it from competing.
A second teaser video for Xiaomi's Pinecone lineup has been released. Pinecone is what Xiaomi will be calling their lineup of smartphone SoCs competing against Huawei, Samsung, MediaTek, and Qualcomm.
Samsung has just unveiled the Exynos 9 Series 8895 system-on-a-chip. This 10nm chip is the SoC that will power the upcoming Galaxy S8 flagship and it comes with some very powerful features.
Intel unveiled today a slew of new products and partnerships designed to be the basis for the upcoming 5G revolution. Between new chips and collaboration Intel seems poised to capture the 5G market.
Xiaomi will be joining the likes of Apple and Samsung by building its own chips for mobile devices. Its first SoC will be unveiled next week and is expected to show up in the upcoming Xiaomi Mi 5c.
Qualcomm announced its first two products that support the emerging Wi-Fi standard 802.11ax. The next step for our connectivity is designed to better handle a large number of simultaneous users.
MediaTek has announced a refresh of its deca-core Helio X20 and Helio X25 processors that offer higher clockspeeds on both the CPU and GPU. MediaTek says this provides a 20% performance boost.
Samsung Electronics will purchase Harman International Industries for $8 billion in a deal set to clear in mid-2017. Harman is best known for connective automotive technologies and audio brands.
Samsung has confirmed today that it has started mass-producing 10nm chips, to be used in upcoming devices like the Galaxy S8. Samsung is also rumored to be manufacturing Qualcomm's Snapdragon 830.
After having withdrawn its mobile Atom processors from the market earlier this year, Intel President Venkata Renduchintala provided some more context regarding the company's sudden exit.
AMD has announced the availability of its new Bristol Ridge processors for desktops. The new chips offer better graphics and support for Ultra HD media, and run on the AM4 socket.
