iPhone 6 PCB leak points to NFC and 802.11ac

It’s another week and we have yet another leak for the upcoming iPhone 6. Just when you think that it might be another leak of the outer casing, we get a surprise in the form of a PCB board. Although not the most exciting component, we get to take a look at the purported innards of the 4.7” model of the iPhone 6. 

Apple has been rumored to be working on NFC for the iPhone and other products for quite some time. Each iteration of the device, has been surrounded by rumors, but Apple has consistently omitted the technology upon final release. 

According to Nowhereelse.fr, the new board reveals that it will have NFC (near field communication) and a faster Wi-Fi component that will support 802.11ac. This cannot be verified by looking directly at the supplied images, but reliable sources close to the site say that these features will be onboard for the handset. 

To lend a bit more credibility to the PCB board images, the site compared the image of the board, to pictures of the overly leaked casing from the iPhone 6. In this instance, we can see that the screw holes for the board match up fairly well to those on the case. Currently, the leaked boards do not have any of the processing chips, which will allow the board to function.

The iPhone 6 will have be available in two sizes. One is rumored to have a 4.7” screen and the other a 5.5” screen; The device is scheduled to launch sometime in Fall 2014. 

Source: Nowhereelse.fr | Image via Nowhereelse.fr

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