18 replies to this topic

[+Chris123NT]

I've always spread it out, this way I know there won't be too little or too much, i get the perfect amount for perfect coverage and contact every time. I always get great temps this way as well.

[Praetor]

Nagisan, on 04 October 2012 - 15:18, said:

Awesome.....although that did lead to a nice video of why you should use the pea method

.

Basically the line method works but will more easily fall off the edge, the spreading a thin layer method increases the chances (significantly) of getting air bubbles. The pea method doesn't do either of that and is much easier to do.

I've used the pea method and have never had any heating issues on my CPU unless I go crazy overclocking without throwing on water cooling.

nice test, i've used the "spreading a layer" method and moved on to the "whirlpool" method, still never had overheating issues, but now it seems that the pea method is more efficient. gonna try that.

ThunderBuddy, on 04 October 2012 - 15:04, said:

This is how I do it.

lmfao poor abit board!

[AnDom]

Single "pea sized" dot in the center is the general recomendation (multiple manufacturers suggest this procedure). Here is a page that gives examples of various issues with application methods:

http://www.innovatio...nstructions.htm

[+jamesyfx]

Well the first thing I'd do is clean the chip with TIM-Clean or IPA so it's perfectly clean.

Then I just put a small blob on the centre of the chip. The pressure of the heat sink should be enough to give it an even spread.

Some people use spreaders, but I don't.