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XBOX ONE Main Components Teardown inc Hi Res X-Rays !

xbox one hardware splooge

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#1 +FiB3R

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Posted 28 November 2013 - 03:45

"This is really great stuff - thanks to TechInsights" via team-xecuter

xbox-one-boardshot-front.jpg

xbox-one-boardshot-back.jpg

xbox-one-bom.jpg

Technical Specifications

The Xbox One’s processor was co-developed by Microsoft and AMD. It combines a CPU (central processing unit) and GPU (graphics processing unit), as well as the Xbox One’s memory controller and video decoder.
Design Win - Xbox X887732-001 Processor DG3001FEG84HR (includes AMD "Jaguar" Cores and AMD Radeon Graphics GPU)

xbox-one-package.jpg

xbox-one-processor-xray.jpg

xbox-one-diephoto.jpg


Xbox X861949-005 T6WD5XBG-0003 Support Processor

xboxone-supportprocessor-Pkg.jpg

xboxone-supportprocessor-PkgB.jpg

xboxone-supportprocessor-Die-Mark-1.jpg

xboxone-supportprocessor-Die-Mark-2.jpg

xboxone-supportprocessor-diephoto.jpg

xboxone-supportprocessor-xray.jpg

Wireless Connectivity Design Win - Marvell Avastar 88W8897M (Wi-Fi, Wi-Fi Direct, Bluetooth, NFC)

MarvellAvastar-PkgT.jpg

MarvellAvastar-PkgB.jpg

MarvellAvastar-DiePhoto.jpg

MarvellAvastar-DieMark.jpg

MarvellAvastar-Xray.jpg


 




#2 OP +FiB3R

FiB3R

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Posted 28 November 2013 - 03:45

SDRAM Design Win - SK Hynix H5TQ4G63AFR 4 Gb (512 MB) DDR3 SDRAM (total of 16 x 512 MB = 8 GB)

SKHynix-SDRam-PkgT.jpg

SKHynix-SDRam-PkgB.jpg

SKHynix-SDRam-DieMark.jpg

SKHynix-SDRam-DiePhoto.jpg

SKHynix-SDRam-Xray.jpg

NAND Flash Design Win - SK Hynix H26M42003GMR 8 GB e-NAND Flash

SKHynix-eNAND-Flash-PkgT.jpg

SKHynix-eNAND-Flash-PkgB.jpg

SKHynix-eNAND-Flash-DiePhoto.jpg

SKHynix-eNAND-Flash-DiePhoto-2.jpg

SKHynix-eNAND-Flash-DieMark-1.jpg

SKHynix-eNAND-Flash-DieMark-2.jpg

SKHynix-eNAND-Flash-XRay.jpg

SKHynix-eNAND-Flash-XRay-XView.jpg

SKHynix-eNAND-Flash-XRay-XView-CloseUp-1

SKHynix-eNAND-Flash-XRay-XView-CloseUp-2

SKHynix-eNAND-Flash-XRay-ZView.jpg



#3 vcfan

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Posted 28 November 2013 - 03:53

tons of porn :drool: 



#4 Atomic Wanderer Chicken

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Posted 28 November 2013 - 03:56

That was very mesmerizing!



#5 trooper11

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Posted 28 November 2013 - 03:57

Very cool to see it all laid out like that.

Its still interesting that MS chose a wireless device that supports Bluetooth and the AC standard. Wonder if they will bring that out as an update down the road.

#6 vcfan

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Posted 28 November 2013 - 04:05

the support chip a.k.a southbridge is huge. some of those wires are at least a micron wide. that looks like 350nm process no doubt. I hope the bootrom isn't in there(because I do see a small rom) and instead in the cpu because that thing will get dumped in no time. I can read TSMC like a book,and that is definitely them for this chip as well.



#7 HawkMan

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Posted 28 November 2013 - 05:01

Very cool to see it all laid out like that.

Its still interesting that MS chose a wireless device that supports Bluetooth and the AC standard. Wonder if they will bring that out as an update down the road.

 

Unless the antenna is there. no go. 



#8 trooper11

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Posted 28 November 2013 - 05:33

Unless the antenna is there. no go.


Would a different antenna be needed though? I mean is it possible that the one they are using for the current wireless standards could handle say AC support?

#9 HawkMan

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Posted 28 November 2013 - 07:13

Would a different antenna be needed though? I mean is it possible that the one they are using for the current wireless standards could handle say AC support?


AC support could potentially be patched in, it should use the same antenna as regular wifi, but it might need additional support components.

#10 George P

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Posted 28 November 2013 - 08:20

Still no idea what the extra 8GB of NAND is for?



#11 Mr.XXIV

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Posted 28 November 2013 - 08:32

Still no idea what the extra 8GB of NAND is for?

 

Fun

 

Edit: No, I was serious. "Developer" Fun.