AMD details specs of new Ryzen AI Max 400 series APUs

Earlier this year at CES 2026 AMD introduced its Ryzen AI 400 series APUs for the first time on mobile platforms. Later in March the company also expanded its desktop portfolio to include the 400 series APUs. Built on the same Zen 5 architecture, AMD today is expanding it further as it is launching the new Ryzen Max PRO 400 series as the successor to the Max PRO 300.

The flagship SKU, the Ryzen AI Max+ PRO 495, will be inside the next generation of the new Ryzen AI Halo platform. It is a powerful 16-core 32-thread part with a base and boost clock frequency of 3.1 and 5 GHz respectively. It packs 80MB of cache memory. All this will be powered within a configurable TDP (cTDP) package of 45 to 120 watts. As always with Max APUs, the new 400 series also has a big chunk of die allocated to the on-board graphics with 40 RDNA 3.5-based CUs (compute units). The 495 will also feature an NPU built on the XDNA 2 architecture and is capable of 55 TOPS.

Aside from the 495, AMD is also introducing the Ryzen AI Max+ PRO 490 and Max+ PRO 485. These pack fewer CPU cores at 12 cores and 8 cores. The GPU CU count also comes down from 40 to 32; the NPUs are slightly less capable with 50 TOPS output though all of them still qualify for Copilot+ PCs.

Compared to the Ryzen AI Max PRO 300 series, the 400 series supports 50% higher LLM processing handling at 300 billion+ parameters (the world"s first x86 CPU capable of doing so), and to help do this, memory support goes up from 128GB on the 300 series to 192GB on the 400 series. Out of the 192 Gigs, up to 160 GB can be used as VRAM, whereas previously, the 300 series could use up to 96GB as VRAM. These will be available in Q3 2026 (towards the end of this year).

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