Infineon Boosts DDR2 FB-DIMM Deployment


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Designs and Manufactures All Key Components for Industry?s Next-Generation Server Memory Modules; Delivers AMB-Chip to FB-DIMM Manufacturers

At the Intel Developer Forum (IDF) in San Francisco today, Infineon Technologies AG (FSE/NYSE: IFX), a leading supplier of memory products, announced that it is sampling the industry?s only Double Data Rate 2 (DDR2) Fully Buffered Dual-In-line Memory Modules (FB-DIMMs) with all key components designed and manufactured by a single DRAM supplier. Available in densities ranging from 512MB (megabytes) to 4GB (gigabytes), the new FB-DIMMs are based on an Advanced Memory Buffer (AMB) chip, DDR2 DRAM chips and a proprietary heat sink all sourced from Infineon. Additionally, Infineon offers the AMB logic chip to other FB-DIMM manufacturers and has already shipped samples to first customers.

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