How to apply Thermal Compound

[+shift. MVC]

I wasn't quite referring to the lapping and sanding down of a heatsink, as doing that to a HDT cooler could potentially ruin your heatpipes (I've seen pictures where the heatpipe has actually collapsed due to sanding / lapping).

What I was referring to was the thermal interface material application method that allows for the maximum surface area covered by the thermal interface material thus resulting in more of the base being used leading to improved thermal performance.

Here's an example.

From Hardware Canucks' Xigmatek S1283 Review

Xigmatek S1283 with regular (dot in the middle) TIM application method:

http://www.hardwarecanucks.com/forum/hardw...-review-10.html

Xigmatek S1283 with aforementioned TIM application method:

http://www.hardwarecanucks.com/forum/hardw...-review-15.html

2C drop in max load temperatures at 3.4GHz (55C with first method, and 53C with second method)