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By Usama Jawad96
Here is Intel's architecture roadmap for 2025 and beyond
by Usama Jawad
At its Accelerated event, Intel had a bunch of stuff to announce regarding its node naming strategy and architecture roadmap for products that it will power through 2025 and beyond. It has also unveiled its first new transistor architecture in over a decade, and named it RibbonFET.
First up is Intel's new node naming strategy detailed in the roadmap seen above. The company is making these changes to offer customers a vivid view of process nodes as well as establish a consistent framework.
Intel 7 - previously known as Enhanced SuperFin - is targeted for Alder Lake in client machines and Sapphire Rapids for data centers. The latter will enter production phase in the first quarter of 2022. Next ups is Intel 4 - previously known as 7nm -, the salient features of which can be seen in the graphic above. Intel 3 will be another incremental upgrade after that and will focus on "power and area improvements".
Finally, 2024 will see the advent of Intel 20A which will offer two breakthrough innovations in the way of RibbonFET and PowerVia. The former will be an implementation of a gate-all-around transistor and will allow for superior transistor switching speeds in a smaller footprint. The latter is an implementation of backside power delivery which optimizes the transmission of signals by eradicating the need for power routing on the wafer's front side. The company has tapped Qualcomm as a partner for this process.
From 2025 and beyond, Intel will be focusing on 18A, which will include enhancements to RibbonFET as well as next-gen High NA EUV. The firm will be partnering with ASML for these improvements. Intel's CEO Pat Gelsinger had the following to say regarding the company's ambitions:
Since the company is focused on Moore's Law, it also makes sense to talk about packaging enhancements planned for the next few years under its integrated device manufacturing (IDM) 2.0 model.
Embedded multi-die interconnect bridge (EMIB) has been used in products since 2017 and will continue to be used in Sapphire Rapids next year as well. After that, it will feature an incremental upgrade and will transition from a 55-micron bump pitch to 45 microns. Meanwhile, Foveros will be a 3D stacking solution and will be present in Meteor Lake for client products. It will have a bump pitch of 36 microns and a thermal design power range of 5-125W.
Next, we'll see Foveros Omni and Foveros Direct. The former will enable die segregation and is expected to hit mass production in 2023. On the other hand, Foveros Direct will be complementary to Omni, and will allow bump pitches of sub-10 microns, increased interconnect density, and copper-to-copper bonding for low-resistance interconnects. It will also be ready for volume manufacturing in 2023.
Intel plans to reveal more details about all these technologies at its InnovatiON event on October 27-28, 2021. It will be held in San Francisco and can be viewed online as well. You can find out more details here.
By News Staff
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by Steven Parker
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These are the first 16 cities in the U.K. where EE will bring 5G connectivity
by Paul Hill
Image via EE The U.K. mobile operator, EE, has announced plans to roll out 5G connectivity in 16 cities next year. The firm said it plans to launch in six cities initially, including in the capitals of England, Wales, Scotland, and Northern Ireland, and then it plans to bring it to ten additional cities during 2019. Initially, the firm wants to serve the busiest parts of the launch cities in order to give the more under-pressure areas some respite.
The initial launch cities will be London, Cardiff, Belfast, Edinburgh, Birmingham, and Manchester. Throughout 2019 it will come to additional cities including Bristol, Coventry, Glasgow, Hull, Leeds, Leicester, Liverpool, Newcastle, Nottingham, and Sheffield. Some of those busy places where the firm wants to deliver 5G initially include Hyde Park in London, Manchester Arena, Belfast City Airport, the Welsh Assembly, Edinburgh Waverly train station and Birmingham’s Bullring.
EE is a part of BT Group, Marc Allera, CEO of BT’s Consumer division, said the following about today’s news:
To accompany the launch of 5G, EE also plans to begin selling 5G smartphones with its partners and introduce a 5G Home router that will deliver 5G broadband – it said this will showcase the power of 5G for broadband. It’s not clear yet whether 5G will come to replace typical broadband setups in the near future but 5G will deliver as good, if not better speeds.
Additionally, EE plans to carry on upgrading 4G sites while turning 3G signal into 4G. This will free up spectrum for an improved experience but it will also mean a loss of network for those still using 3G-only mobile devices.
Linux creator Linus Torvalds has harsh words for Intel over chip design
by John Keefer
The tech community is having a meltdown of sorts over the revealed vulnerabilities in most processor chip architectures, leaving them open to creative hacks that could access valuable security information of users. Intel has been taking the brunt of the heat because its chips are vulnerable to all three variants because of design choices. Linux OS creator Linus Torvalds had some choice words for the company.
"I think somebody inside of Intel needs to really take a long hard look at their CPU's, and actually admit that they have issues instead of writing PR blurbs that say that everything works as designed," Torvalds said in a tersely worded note sent to a Linux list earlier this week. ".. and that really means that all these mitigation patches should be written with 'not all CPU's are crap' in mind."
Torvalds has the luxury of being outspoken about the problems. Many of Intel's partners have been quietly working on fixes, and while they have made it clear that the flaws are found in Intel chips, they also mention that the Spectre variant is found in AMD chips and the ARM architecture. Criticism, if any, has been mild from most of the tech sector, but an unchained Torvalds did not hold back in the rest of his rant:
Usually, when Torvalds talks, people listen. And he is especially agitated when things affect the open-source OS he created back in 1991. Some users prefer Linux over Windows, but Linux is almost a staple on back-end cloud servers.
While Intel has been working with vendors and tech companies to fix the problems - and has already rolled out some firmware fixes through its partners - nothing will totally protect chips from Spectre, just make the vulnerability harder to exploit. The key is that Meltdown has only been found to target Intel chips, and the ARM Cortex A75. AMD has reported that the architecture of its chips make it immune from Meltdown and hard for Spectre to exploit.
Microsoft and Google have already issued mitigation updates for their software and devices, and ARM has advised developers what to do, specifically detailing Linux fixes. Apple expects to issue fixes for its various operating systems in the very near future.
Intel is already facing a securities investigation on behalf of investors, and numerous lawsuits have also been filed. While Torvalds' criticism may by biting, Intel has plenty of other more pressing concerns.
Source: LKML.org via Business Insider | Image: The Register
Intel: the successor to 8th-gen Core processors will be 'Ice Lake', running on 10nm+ process
by Muhammad Jarir Kanji
Later this month, Intel will reveal its 8th generation of Core processors, known as Coffee Lake, which are expected to feature an improvement of 15-30% over the current generation.
The company is already looking to the future, however, and today revealed the codename for the 9th generation of processors that will follow. In Intel's 3-step 'Process-Architecture-Optimisation' cadence, Coffee Lake will represent a second optimization stage following the current Kaby Lake. Succeeding this will be Cannonlake, which will be a new process - and Intel's first to shrink the die to 10nm.
This will be followed by the 9th generation of Core processors, representing a new architecture phase under the guise of Ice Lake. These processors will "utilize Intel’s industry-leading 10nm+ process technology."
It's still unclear as to how the 10nm+ process will differ from the 10nm process in Cannonlake, though we may gain a better picture of the company's future plans at their unveiling of Coffee Lake on August 21.
The company has been trying its hand at a die shrink to 10nm for a while now and despite numerous delays, it will be interesting to see what Intel will come up with, especially as AMD is quickly catching up in the performance department with the recent releases of its Ryzen and Threadripper series.
Source: Intel via VentureBeat