iPhone 3.0 Firmware ready to be Unlocked and Jailbroken around release
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By Hamid Ganji · Posted
This Chinese company is reportedly developing a feature Apple and Samsung can only dream of by Hamid Ganji While companies like Apple and Samsung have been relatively conservative with their devices’ battery capacities in recent years, Chinese manufacturers have taken the competition to the next level by introducing significantly larger batteries. However, the latest report from China suggests that a local company may already be developing a smartphone with a whopping 14,000mAh battery. Chinese leaker Digital Chat Station claimed on Weibo that a smartphone maker is developing a device with a 14,000mAh battery. If true, it would be the largest battery ever used in a smartphone and could, in theory, provide up to a week of battery life on a single charge. The leaker did not reveal the name of the company behind the device, but there are some clues. This week, HONOR unveiled the X80 Pro Max in China with an 11,000mAh battery and 90W wired charging support. The company also launched the Honor Win in January, which packs a 10,000mAh battery. HONOR, a former subsidiary of Huawei, has a proven track record of developing smartphones with unusually large batteries. However, other Chinese brands, including Xiaomi, have also launched devices such as the Xiaomi 17 Pro Max with 7,500mAh batteries. Though Chinese users on Weibo also believe the company behind the new battery is HONOR. Interestingly, Digital Chat Station said the device with the 14,000mAh battery weighs around 220 grams, making it lighter than the Apple iPhone 17 Pro Max (233 grams) and slightly heavier than the Samsung Galaxy S26 Ultra (214 grams). The iPhone 17 Pro Max currently packs a 5,088mAh battery in eSIM-only versions, while the Galaxy S26 Ultra features a 5,000mAh battery. Neither device is expected to see a dramatic increase in battery capacity in its next-generation successor. So when it comes to battery comparison, Chinese brands are unbeaten. HONOR smartphones are currently available in the EU, but the Chinese brand has no official presence in the United States due to restrictions imposed by the U.S. government. -
By xrobwx71 · Posted
https://i.imgur.com/dNY9tNv.png -
By Skyfrog · Posted
I'm not sure I would call Ventoy a Rufus alternative. -
By pradeepviswav · Posted
Qualcomm takes on NVIDIA with new Dragonfly CPU and AI chips by Pradeep Viswanathan Microsoft, Google, Amazon, AMD, Meta, Apple, OpenAI, and several others have been developing their own chips for AI infrastructure. However, NVIDIA still remains the dominant player in the market. Today, Qualcomm announced a major expansion of its data center infrastructure portfolio to better compete with NVIDIA. The new lineup includes the Qualcomm Dragonfly C1000 CPU, Qualcomm High Bandwidth Compute technology, the Dragonfly AI300 inference accelerator, new connectivity products, and custom silicon solutions. Qualcomm claims that this new lineup improves performance per watt, token throughput, and total cost of ownership for AI data centers. The Dragonfly C1000 is a new data center CPU built with Qualcomm’s custom Oryon cores. This chip will feature more than 250 cores, frequencies above 5GHz, and a chiplet-based design. Qualcomm claims that this new C1000 can deliver more than 2x better performance per watt compared to existing server CPU offerings based on specifications. The Dragonfly C1000 will support PCIe Gen 7 with more than 2TB/s of connectivity, along with CXL, advanced RAS features, and both air and liquid cooling. Qualcomm expects the Dragonfly C1000 to be commercially available in 2028. Additionally, Qualcomm and Meta announced a multi-year, multi-generation agreement under which Qualcomm will supply Dragonfly C1000 data center CPUs for Meta’s next-generation server fleet. Qualcomm also announced High Bandwidth Compute, a new near-memory computing architecture designed to address AI’s memory bandwidth bottleneck. HBC Gen 1 will debut with the Dragonfly AI250, which is expected to sample in mid-2027. The AI250 will deliver 133TB/s per card, an 18x increase in effective memory bandwidth compared to the AI200 with LPDDR5X. The new Dragonfly AI300 with HBC Gen 2 is a rack-level AI inference platform from Qualcomm. Qualcomm claims that the AI300 can deliver 4x to 8x better performance per watt compared to existing GPU-based architectures based on memory bandwidth per watt per card. The Dragonfly AI300 is expected to be available in 2028. -
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