Tag: 2.5d packaging

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Samsung Electro-Mechanics (SEMCO) and Amkor Technology have partnered to develop a 2.5D Integration 'H-Cube' solution specialized for semiconductors for HPC, AI, data center, and network products.

Fiza Ali · Nov 11, 2021 with 1 comment

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Channel	Build number
Canary	26257
Server vNext	26244
Dev	26120.1330
Beta	22635.4000
Release Preview	22631.3951
	19045.4713,
Release Preview	26100.1297
Patch Tuesday	22631.3880
	19045.4651

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