At Computex 2026 today, alongside new X3D desktop processors and Radeon RX 9070 GRE, AMD has introduced a new memory overclocking tech as it is expanding its EXPO feature. For those who may not be familiar, EXPO (short for EXtended Profiles for Overclocking) is essentially AMD's version of Intel XMP which allows easier memory overclocking by loading pre-set stable overclocking profiles. Previously Team Red relied on tweaked XMP versions called AMP or A-XMP, but in 2022, EXPO made an entry.
The new EXPO technology is called EXPO ULL, which stands for "Ultra Low Latency." As the name suggests, this new feature will enable support for even lower CL (CAS Latency) DDR5. Obviously there will be some performance benefits, and AMD suggests it is going to be significant. Compared to a stock (JEDEC spec) speed module (DDR5-5600 CL40), the company claims a 13% average FPS improvement with the new EXPO ULL 6000 MT/s kit running at CL28, which is an additional 4 percentage point gain over normal EXPO.
The 1% lows or the 99%-ile frame rate, which is often a more crucial metric that's meant to capture smoothness of gameplay, is said to see an even bigger improvement of 15% over JEDEC speed using ULL, which is again a 4 percentage point advantage over EXPO alone.
These tests were done on AMD's Zen 5-based octa-core Ryzen 9700X. Speaking of the CPU, perhaps a bit ironically, the new 7700X3D, which AMD today launched alongside EXPO ULL, won't really benefit much from this, as 3D V-cache CPUs already have an on-board low-latency chunk of L3 cache.
This is also something AMD highlighted as one of the two major benefits for purchasing X3D SKUs, considering the high RAM prices in the current market.
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