Just months after shipping HBM4, Samsung has announced that it has begun shipping HBM4E to partners to support "increasingly demanding next-generation AI workloads."
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The production for 10nm DRAM called "D1d" has reportedly been paused by Samsung for an indefinite period due to low profitability and low demand from customers.
Samsung has raised prices on months-old devices across its U.S. stores, hitting phones, foldables, and nearly every tablet it sells. Some jumped over $200 with zero warning.
Raspberry Pi is adjusting prices on high-density products (4GB/8GB) due to a 120% jump in LPDDR memory costs, a side effect of the AI boom.
Nvidia is preparing a special edition of the RTX PRO 6000 GPU for the Chinese market. It will use different memory to meet US export controls.
Samsung has announced its next evolution of GDDR memory in the form of the new GDDR6W technology. The new tech promises close to HBM levels of performance while smaller than traditional GDDR6.
Intel has unveiled the Intel Max Series product family for high-performance computing (HPC) and artificial intelligence ahead of Supercomputing '22 (SC22) in Dallas happening between November 14-17.
Samsung Electro-Mechanics (SEMCO) and Amkor Technology have partnered to develop a 2.5D Integration 'H-Cube' solution specialized for semiconductors for HPC, AI, data center, and network products.
SK hynix recently updated its website and it appears to have inadvertently leaked some of the details of next-gen 3D stacked HBM3. The new memory will be close to 50% faster than the current HBM2E.
Samsung has introduced its latest processing-in-memory architecture or PIM. According to the firm, this new innovation is able to double the output while also significantly reducing the power draw.
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