SK hynix recently updated its website and it appears to have inadvertently leaked some of the details of next-gen 3D stacked HBM3. The new memory will be close to 50% faster than the current HBM2E.
Build released to Dev channel fixes underlying issues with Start menu
windows 11 insider preview
Samsung has introduced its latest processing-in-memory architecture or PIM. According to the firm, this new innovation is able to double the output while also significantly reducing the power draw.