As part of the US trying to become self-reliant in semiconductor manufacturing, Intel has secured an agreement with the Department of Defense to provide chip fabrication services with the government.
Intel says that its latest fab complex will consist of chip packaging facilities and multiple modules that will have the potential of processing wafers by employing its advanced process technologies.
Intel has detailed its architecture roadmap up until 2025 and beyond. It features a new node naming strategy, a transistor architecture, and packaging enhancements under the IDM 2.0 model.
Intel initially planned a release for its 10nm-based chips back in 2015-16 with Cannon Lake but that didn't happen. However, 10nm yields are finally improving says Intel at its Q2 2021 earnings call.
Intel reportedly wants to acquire GlobalFoundries according to a new report. Apparently, the company is currently exploring the possible options and the deal could go through for a sum of $30 billion.