Intel has provided new details regarding its latest fab complex in the United States. Intel CEO Patrick Gelsinger stated that the new fab campus will cost between $60 billion and $120 billion.
Gelsinger also stated:
We are looking broadly across the U.S.. This would be a very large site, so six to eight fab modules, and at each of those fab modules, between 10- and $15 billion. It's a project over the next decade on the order of $100 billion of capital, 10,000 direct jobs. 100,000 jobs are created as a result of those 10,000, by our experience. So, essentially, we want to build a little city.
By the end of this year, Intel will finalize the location of its upcoming major semiconductor manufacturing hub in the United States as part of its IDM 2.0 strategy. The complex will incorporate between six and eight modules that will manufacture chips by employing the avant-garde fabrication processes of the company. Furthermore, it will be capable of packaging chips by making use of Intel's propriety techniques such as EMIB and Foveros, and will operate a dedicated power plant.
Intel has not revealed which nodes the initial module of the latest facility will support but since it will probably be operational as early as 2024, the fab will likely manufacture chips by employing the Intel 4 and the Intel 3 manufacturing technologies. The production capacity of the new facility has also not been revealed yet.
Gelsinger further said that:
We're engaging with a number of states across the United States today who are giving us proposals for site locations, energy, water, environmentals, near universities, skill capacity, and I expect to make an announcement about that location before the end of this year.
Each semiconductor fabrication module will cost between $10 billion and $15 billion so, there is a possibility that the investments by Intel into the complex over the course of the next ten years could top $120 billion or be as low as $60 billion.
Source: Tom's Hardware