Intel is investing $7 billion by expanding and improving its Malaysian semiconductor packaging facility. The new packaging will not only reduce costs but also improve performance and power.
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The world's second largest maker of x86 microprocessors, Advanced Micro Devices, disclosed plans to introduce enhanced multi-core processors that support built-in DDR3 memory controller as well as to present platform initiatives that allow more than...
As Microsoft looks at offering tailored, market-specific Office System products, this fall it will release in Japan a new product called Microsoft Office Interconnect, currently under beta testing, that is essentially a contact manager. The...
