Next-gen iPhone component list leaked?

It's been a few days since there's been an iPhone rumor, so here goes folks. DigiTimes has posted a component list, complete with suppliers, for Apple's inevitable next-gen iPhone.

Source: DigiTimes.

The sources are all from the industry supplying the components to Apple, and they state that the new "iPhone 3.0" will be launched mid-2009, and shipments will kick off in May, with the first being in the amount of 5 million units. DigiTimes states, "TSMC have landed foundry orders for GSM EDGE power amplifiers, Bluetooth ICs and 3.2-megapixel OmniVision CMOS image sensor (CIS) used in the upcoming iPhone model, indicated the sources. Xintec will handle the packaging and testing service for the CIS whereas VisEra will manufacture on-chip color filters for the CIS."

This is just another rumor in the pot, which again seems to indicate a new iPhone will be released this year. It's pretty obvious now, but it's always nice to see more (rumored) proof that it's happening.

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