Today, Western Digital has announced that they successfully developed a 96-layer 3D NAND bit storage technology. According to WD, it will allow them to squeeze up to one terabit into a single chip.
Roughly, 3D NAND is a method where multiple storage modules are stacked so that the same space on the board can be used to house larger storage capacity. WD has improved on the current 64-layer BiCS3 technology currently in use. Squeezing more data capacity into the same space will result in higher capacity drives or smaller storage modules.
WD plans a multitude of storage capacities when the drives go into full production. They also expect that the technology will prove more cost effective than the current mass adopted storage technologies used by hardware manufacturers.
Initial production is expected during 2018, with a sample going out to OEM customers this year. Western Digital reiterated that, with their current partner Toshiba, they will command the largest share in the 64-layer BiCS3 3D NAND market in 2017.
Source: Business Wire
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