Intel finally demos its 10nm Ice Lake chip, expands 9th Gen CPUs, and more

Intel initially planned to debut its 10nm Cannon Lake processors in 2016, but the company was repeatedly forced to cancel those plans last year after a previous delay. At CES 2019, the semiconductor company has finally demonstrated its first 10nm Ice Lake chip, which is based on the Sunny Cove architecture.

Ice Lake will come integrated with Thunderbolt 3, Wi-Fi 6, and DL Boost (deep learning boost) systems for use in consumer PCs. According to Intel, laptops with the new processor are slated for rollout in the holiday season of this year, assuming no further delays.

In addition, the company made several announcements related to its artificial intelligence, 5G, and autonomous driving efforts. During the event, Intel debuted Project Athena with the goal of helping PC makers build laptops with 5G and AI. The initial batch of Project Athena devices will be released in the second half of 2019.

Intel also exhibited its new Lakefield client platform featuring Foveros, a new 3D packaging technology. Announced in December 2018, it is designed to allow for the stacking of additional processing power in addition to chip die that's already assembled.

The 9th Gen Intel Core desktop range has also been expanded following its debut in October of last year, with the first of the latest processors being slated for rollout this month. For its AI efforts, Intel unveiled the Nervana Neural Network Processor for Inference (NNP-I), which is designed for high workload inference. The company also revealed that it will expand its investment into the development of 5G networks with the 10nm-based network-system-on-chip called Snow Ridge. Availability of this SoC is scheduled in the second half of 2019.

Neowin is at CES to bring you all the coverage from the show floor, click here for other articles.

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