After announcing the ZenFone 3 Deluxe in July and launching it in Taiwan this past September, ASUS will bring three different versions of the device to the U.S. market this October. The ZenFone 3 Deluxe Special Edition is the flagship handset of the group and notably uses the Qualcomm's new Snapdragon 821 chip. The company will also release a ZenFone 3 Deluxe with the Snapdragon 820 chip, as well as a model with the Snapdragon 625.
The two more expensive versions use a 5.7-inch 1080p AMOLED display and incorporate Sony’s new 23-megapixel IMX318 sensor for imaging purposes. The bottom-tier model comes with a 5.5-inch IPS 1080p display and a 16-megapixel camera unit. All of the rear cameras support 4K video recording, optical image stabilization (OIS) and ASUS’s Tri-Force auto-focus technology. Additional features include 6GB of RAM on the two more expensive models, USB Type-C connectivity and a 3,000mAh non-removable battery.
Other distinctions are the Special Edition's 256GB of standard storage space as opposed to the 64GB available in each of the two other models. All three support expandable storage via a microSD card slot.
Design-wise, the ZenFone 3 Deluxe utilizes an all-metal unibody chassis, which ASUS says hides the device's wireless antennas without affecting its performance. All versions are currently only available in ASUS’s Glacial Silver color.
The ZenFone 3 Deluxe Special Edition is priced at $799 with an estimated delivery date of October 19. Consumers can also order the two more modest ZenFone 3 Deluxe models for $499 and $399 respectively, with an earlier shipping date of October 12.
At Google's own hardware event this past week, the company launched the Pixel and Pixel XL phones, which both use the Snapdragon 821 chipset.