Today, Samsung Electronics stated that it has started the mass production of the LPDDR5 UFS-based multichip package (uMCP), its most recent smartphone memory solution. It combines LPDDR5 DRAM with UFS 3.1 NAND flash that enables it to deliver performance that matches flagship-level capabilities to a wide array of smartphone users.
Vice president of the Memory Product Planning Team at Samsung Electronics, Young-soo Sohn stated:
Samsung’s new LPDDR5 uMCP is built upon our rich legacy of memory advancements and packaging know-how, enabling consumers to enjoy uninterrupted streaming, gaming and mixed reality experiences even in lower-tier devices. As 5G-compatible devices become more mainstream, we anticipate that our latest multichip package innovation will accelerate the market transition to 5G and beyond, and help to bring the metaverse into our everyday lives a lot faster.
As uMCP of the tech giant is centered around the latest NAND and DRAM interfaces, it is capable of delivering high storage space and fast speed at considerably low power. This integration makes it possible for the users to employ various 5G applications such as augmented reality (AR), graphics-intensive gaming, and advanced photography, that were available only on premium flagship devices formerly. The company has been able to provide its customers this flag-ship level competence by enhancing DRAM performance from 17 gigabytes per second to 25 gigabytes per second, and NAND flash performance from 1.5 gigabytes per second to 3 gigabytes per second, as compared to the former LPDDR4X-based UFS 2.2 solution.
The latest uMCP aids in enhancing space efficiency as well by merging NAND and DRAM storage into a compact package with 11.5mm × 13mm dimensions. The company has also wrapped up its compatibility testing of the LPDDR5 uMCP with some global smartphone manufacturers and hopes that devices equipped with a UFS-based multichip package can be made available for purchase this month.