Samsung Electronics reported its Q2 2021 earnings yesterday. The company has done well overall and its memory business is no exception. The firm is expecting to see continuous growth in this division, especially in the case of DRAM products that are designed for the high-end server and high-performance computing (HPC) markets. That's why Samsung has been pushing its high-density memory modules for such use-cases and the company recently released the industry's first 512GB DDR5 DRAM module, a truly high capacity solution from any angle you look at.
But as it turns out, the South Korean giant may not be done yet as it plans to go even further by producing a 768GB DDR5 module, using 24Gb DRAM chips, sometime in the near future. This can be inferred from the firm's earnings call transcript (via Seeking Alpha), where a Samsung representative has mentioned that the company is "developing a maximum 24-gigabit DDR5 product". He also added that the tech giant is sampling its 14nm DDR5 products for upcoming Intel Alder Lake processors that are expected to launch later this year, possibly on October 27-28 at the Intel Innovation event.
Here's the full statement of the Samsung representative:
To give you an update on our DDR5, we are currently in sampling of our 14-nano [sic] DDR5, in line with the schedule for the new CPU launch that supports DDR5 and PC, i.e., [sic] Gen 5. The mainstream of the DDR5 is expected to be the 16-gigabit-based high-density product. And so we think that this DDR5 will be the product that significantly gives -- stimulates the trend of high density. Also, in addition to that, in order to meet the demand and request by the cloud companies, we are also developing a maximum 24-gigabit DDR5 product.
It's possible that Samsung will be using its new S2FPD02 power management integrated circuit (PMIC) in the 768GB DDR5 memory, which promises up to 91% power efficiency compared to last-gen products. You can view the company's Q2 earnings press release here.
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