Samsung Electro-Mechanics (SEMCO) and Amkor Technology have partnered to develop a 2.5D Integration 'H-Cube' solution specialized for semiconductors for HPC, AI, data center, and network products.
Samsung recently released the world's first 512GB DDR5 memory module. But the company is planning to go even further by developing a new 768GB module using 24Gb DRAM chips in the future.
At the ongoing ISC 2021 event, Intel has released more details regarding its next-gen server platform including the Sapphire Rapids Xeons as well as its Xe HPC-based Ponte Vecchio HPC accelerators.
Intel has released a patch that claims to fix a problem related to Speed Select Technology (SST), which is causing a performance loss of more than 10%. SST is a power management solution on Xeons.
Samsung has built the industry's first DDR5 memory compatible with the CXL interface. CXL is a cache-coherent interconnect which allows for high-performance heterogeneous computing.
Gigabyte has launched over 40 new server products that use AMD's newly announce EPYC 7003 Series processors. The firm said the CPU excels at high-performance computing a data analytics.
AMD's third-gen EPYC processors, codenamed Milan, will be launched next week on the 15th via a digital event. The event will be streamed on the AMD EPYC events page from 8 a.m. PT or 11 a.m. ET.
Intel is now one of the 14 companies recognized as having deep domain expertise in providing high-performance compute platforms, solvers, and management solutions via AWS resources to its customers.
Samsung has introduced its latest processing-in-memory architecture or PIM. According to the firm, this new innovation is able to double the output while also significantly reducing the power draw.
Samsung has announced a new technology called eXtended-Cube (X-Cube) that will enable more performant and efficient devices. It said the technology unlocks next-gen applications like 5G.
Samsung has announced that it's expanding its foundry capacity by opening up a new line in Pyeongtaek, Korea. The hardware produced there will be used for 5G, HPC, and AI solutions.
AMD's next-gen Epyc and Instinct will be inside the El Capitan exascale supercomputer. Expected to be the fastest Supercomputer ever, it will be overlooking U.S. nuclear research operations.
At SC19, Intel revealed more information about its GPU-accelerated HPC, AI and exascale ambitions. The company also announced the rumored Ponte Vecchio GPU which will drive such solutions.
Intel has announced the Cooper Lake processor which it described as the future of the Intel Xeon Scalable processor family. Cooper Lake is expected to go on sale from the first half of 2020.
Hewlett Packard Enterprise (HPE) has announced its intention to buy supercomputer manufacturer Cray in a deal valued at $1.3 billion. The acquisition is expected to close by Q1 of HPE's FY2020.
Samsung has revealed some new Z-SSD devices aimed at HPC and AI tasks. The SZ985 drives come in 800GB and 240GB variants and can perform 30 drive writes per day for five years before failing.
In an effort to bring more high-performance computing capabilities to those who need it, Microsoft has announced that customers will be able to provision Cray supercomputers in some Azure datacenters.
Version 8 of Bright Cluster Manager has just been released, and features better integration with Azure for High Performance Computing scenarios such as extending capabilities via "cloud bursting".
The chipmaker introduced its new product for the HPC market dubbed “Xeon Phi”, a new “co-processor” that will work in tandem with Xeon CPUs to deliver new levels of performances.
If you've got a spare supercomputer that is just sitting around waiting to test pre-released software on, then you'll be glad to hear that Microsoft has made the Community Technical Preview (CTP) of Windows HPC...